Customization: | Available |
---|---|
Usage: | Small-sized LCM |
Digital LCD Module Type: | 4.3 Inch |
Still deciding? Get samples of US$ 50/Piece
Order Sample
|
Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
---|
Payment Methods: |
|
---|---|
Support payments in USD |
Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
---|
Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
---|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Item of general information |
Contents |
Unit |
|
LCD Display Size (Diagonal) |
4.3 |
inch |
|
Module Structure |
LCD Display + CTP Touch |
- |
|
LCD Display Type |
TFT/IPS |
- |
|
LCD Display Mode |
Normally Black |
- |
|
Recommended Viewing Direction |
ALL VIEW |
- |
|
Module size (W×H×T) |
105.80×85.09×6.73 | mm |
|
Active area (W×H) |
95.04*53.86 |
mm |
|
Number of pixels (Resolution) |
800RGB×480 |
pixel |
|
Pixel pitch (W×H) |
0.1188×0.1122 |
mm |
|
Color Pixel Arrangement |
RGB Stripe |
- |
|
Module Interface Type |
LCD |
RGB | - |
CTP |
12C |
- |
|
Module Power consumption |
500(Max) |
mA |
|
Color Numbers |
16.7M |
- |
|
Backlight Type |
White LED |
- |
Parameter of absolute maximum ratings |
Symbol |
Min |
Max |
Unit |
Operating temperature |
Top |
-20 |
70 |
ºC |
Storage temperature |
Tst |
-30 |
80 |
ºC |
Humidity |
RH |
- |
90%(Max 60ºC) |
RH |
Item No. |
Items to be inspected | Inspection Standard |
Classification of defects |
1 | Difference in Spec. | Not allowable | Major |
2 | Pattern peeling | No substrate pattern peeling and floating | Major |
3 |
Soldering defects |
No soldering missing | Major |
No soldering bridge | Major | ||
No cold soldering | Minor | ||
4 |
Resist flaw on PCB |
Visible copper foil (Φ0.5 mm or more) on substrate pattern is not allowed |
Minor |
5 | FPC gold finger | No dirt, breaking, oxidation lead to black | Major |
6 |
Backlight plastic frame |
No deformation, crack, breaking, backlight positioning column breaking, obvious nick. |
Minor |
7 |
Marking printing effect |
No dark marking, incomplete, deformation lead to unable to judge |
Minor |
8 |
Accretion of metallic Foreign matter |
No accretion of metallic foreign matter (Not exceed Φ0.2mm) |
Minor |
9 | Stain | No stain to spoil cosmetic badly | Minor |
10 | Plate discoloring | No plate fading, rusting and discoloring | Minor |
11 |
1. Lead parts |
a. Soldering side of PCB Solder to form a 'Filet' all around the lead. Solder should not hide the lead form perfectly. |
Minor |
b. Components side(In case of 'Through Hole PCB') Solder to reach the Components side of PCB. |
Minor |
||
2. Flat packages |
Either 'Toe'(A) or 'Seal'(B)of the lead to be covered by "Filet". Lead form to be assume over Solder. |
Minor |
|
3. Chips |
(3/2) H ≥h ≥(1/2) H | Minor |
|
4. Solder ball/Solder splash |
a. The spacing between solder ball and the conductor or solder pad h ≥0.13 mm. The diameter of solder ball d≤0.15 mm. |
Minor |
|
b. The quantity of solder balls or solder splashes isn't beyond 5 in 600 mm2. |
Minor | ||
c. Solder balls/Solder splashes do not violate minimum electrical clearance. | Major |